BEST Inc. provides laser depaneling services for printed circuit board manufacturers along with EMS and OEMs. BEST’s numerous lasers are equipped to take care of volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. It will be the right approach to use when you can find sharp corners or many tight radii of curvature from the PCB Router or maybe in the flex circuit.
Dependant upon the material and the part requirements, BEST laser services supplies a tool-less part removal process in the form of final perforation, scoring and hold-in tabs. By using a laser to do the depaneling gives the user the benefit of speed and positional accuracy. Unlike mechanical methods there is absolutely no part induced stresses, no tooling cost and no cutting oils or another contaminants.
rigid flex depanelizedIn addition BEST could be that provider of laser depanelization if you have a lot of IoT devices which need to be precisely machined or cut out to match perfectly in to small mechanical enclosures.
Due to the contact-free processing that continues with Laser PCB Depanelizer of printed circuit boards, there is very little distortion even when thin materials are utilized. When boards are milled or punched out using a mechanical tool there could show to be a loss precision and potentially a distortion inside the outside board dimensions. Worse yet it could crack solder joints when utilizing these mechanical means. In BEST laser depanelization system feature fiducial registration and on-line scaling, which means already existing distortions may be compensated and also the cut contours positioned precisely within the layout.
Much like scoring or v-grooves, laser perforations are an alternative choice for singulated board removal from a panel or sheet. Perforations might be laser formed to the size and spacing to satisfy the specified removal and securement forces.
Laser scoring can produce a limited depth ablation line from the panelized boards. Generally speaking the depth of the score lines are 50% in the material thickness and may be controlled to some desired depth. The scoring acts inside a manner similar to the hold-tab to secure the part within the panel or sheet, but provides for individual 19dexjpky to become ‘snapped’ out after processing. Laser scoring lines can also be used as being a deliberate path for crack propagation or stress relief. When performing the score lines as a service BEST can either use the IPC guidelines or follow customer requirements.
Hold-in tabs are small uncut sections across the board which are used to secure the PCB Punching Machine within the panel. The hold-in tabs are used for easy handling small boards or printed circuit board securement for further processing. The hold-in tab width is chosen in line with the level of force desired to eliminate the part through the panel/sheet or known forces being applied by downstream processes like component loading. BEST laser services can make tabs in the majority of board materials as well as to nearly any width and site about the part.